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Vortez Hardware - PC Hardware News and Reviews » Articles » ASUS Maximus III Gene P55 Motherboard Review » Page 3

10 pages « 2 3 4 5 > »



ASUS Maximus III Gene P55 Motherboard Review

Posted by: James Clewer (gt_junkie) on: 10/27/2009 11:58 AM [ Print | 0 comment(s) ]

Packaging and board

As with other top end ASUS offerings the Maximus III Gene is immaculately packaged.

It comes in a typically slick looking ROG (Republic Of Gamers) branded box that outlines all the key functionalities of the motherboard.


Box front.


The front states the name and specific functions of the board (with extra info contained under a flap) while the back provides far more detailed information about the boards great many features.


Flap reveals more features.



Box back has more detailed info.


Upon opening you are greeted by the motherboard itself. It's protected by a transparent plastic cover which when removed reveals the board in all its glory. It's nicely packaged and sits in its own cardboard tray within the main box.


The motherboard with plastic cover in place.



First look at the Maximus III Gene itself.


When this is removed we find the various instructions, cabling and other extras that ASUS supply with the Maximus III Gene.


The extras hiding beneath.


More specifically we get 6x SATA cables, an I/O plate, an Nvidia SLi bridge (crossfire bridges are normally supplied with the ATi GPU's themselves), ASUS' proprietary Q-connector, a USB cable for using the 'RoG connect' remote overclocking feature, and a selection of ZIP ties to help keep your pride and joy nice and tidy.


A variety of cables, ties and plates.


Paperwork wise you get a manual, large case sticker, driver DVD (includes Kaspersky Anti Virus too) and some label stickers for your optical and hard disc drives.


Manual and a large case sticker.



HDD and optical drive SATA labels and the driver DVD.


There's no denying that the Maximus III Gene is an impressive looking board. I particularly like the simple but effective two tone colour scheme.


The Maximus III Gene.


Around the back we see the foxconn branded cpu backplate and also notice that the mosfet heatsinks and chipset cooling is screwed in place rather than pushpinned. This should hopefully mean that cooling is the best it can possibly be.


Rear of the board shows heatsinks are secured by screws... nice touch.


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